BESS, Electical Engineering, National Chiao-Tung University,&nbsp; 2008<br>

M.S, Electrical Engineering, Stanford University, 2011<br>

Admitted to Ph.D. Candidacy: 2010-2011<br><br>

Research: Front-end Electronics&nbsp;for Medical Ultrasound Imaging <br>&nbsp; &nbsp; &nbsp;Tremendous work has been done to carry conventional 2D ultrasonic imaging system to a portable 3D imaging system. In order to deal with high complexity of signal interface while achieving miniaturization, functional blocks need to be optimized in a system level perspective. Photoacoustic imaging, which can be considered as a received-only ultrasonic system, is the driver application in this research. <br>&nbsp; &nbsp; Conventional front-ends include only low-noise amplifiers and analog delay lines while the rest of the blocks sit in a back-end processer and connects to the front-end through a cable. However, as the number of channels increases, interconnects between the transducer and CMOS chip become the bottleneck. State-of-the-art has demonstrated the technique of flip-chip bonding between the 2D 32×32 Capacitive Micromachined Ultrasonic Transducer (CMUT) array and IC 1. On the other hand, a single-chip solution for the front-end circuitry of a high-channel count has been shown in recent publication 2. Therefore, this research focuses on the realization of pitch-matched electronics which enable the integration of front-end circuitry for 2D array and maintain the capability of direct assembly with a CMUT array. <br>&nbsp; &nbsp;&nbsp;<br>

1 Anshuman Bhuyan, et al., “Integrated Circuits for Volumetric Ultrasound Imaging With 2-D CMUT Arrays” IEEE Trans. Biomed. Circuits Syst. VOL. 7, NO. 6, DEC. 2013 <br>2 Ji-Yong Um, et al. “An Analog-Digital-Hybrid Single-Chip RX Beamformer with Non-Uniform Sampling for 2D-CMUT Ultrasound Imaging to Achieve Wide Dynamic Range of Delay and Small Chip Area” ISSCC 2014 <br><br>

Email: manchiac AT stanford DOT edu<br>